Beware of Artifacts When Characterizing Nanometer Device Features Smaller than a TEM Lamella Thickness in Semiconductor Wafer-foundries
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چکیده
منابع مشابه
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ژورنال
عنوان ژورنال: Microscopy and Microanalysis
سال: 2014
ISSN: 1431-9276,1435-8115
DOI: 10.1017/s1431927614006722